Silicon Interposers with Integrated Passive Devices: Ultra-Miniaturized Solution using 2.5D Packaging Platform
نویسندگان
چکیده
This paper addresses one of the most promising technologies that meets the demand in terms of miniaturization and increased performance. IPDiA has developed a range of silicon interposers which, when combined with Integrated Passive Devices (IPD) and Through Silicon Vias (TSV), offer a new solution to related portable products, implantable medical devices, avionics and defense.
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